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The purpose of this paper is to provide an overview of the evolution of service supply chain management from a behavioural operations perspective, pointing out future research directions for scholars.

This study searched five databases for relevant literature published between 2009 and 2018, selecting 64 papers for this review. The selected literature was categorised according to two dimensions: a service supply chain link perspective and a behavioural factor perspective. Comparative analysis was used to identify gaps in the literature, and five future research agendas were proposed.

In terms of the perspective of service supply chain link, extant literature primarily focuses on service supply and service co-ordination management, and less on service demand and integration management. In terms of the behavioural factor’s perspective, most focus on classic behaviour factors, with less attention paid to emerging behaviour factors. This paper thus proposes five research agendas: demand-oriented management and integrated supply chain-oriented behavioural research; broadening the understanding of the scope of behavioural operations; integrating the latest backgrounds and trends of service industry into the research; greater attention to behavioural operations in service sub-industries; and multimethod combination is encouraged to be used to dig into the interesting research problems.

This study constitutes the first systematic review of service supply chain research from a behavioural perspective. By categorising the literature into two dimensions, the state of existing research is evaluated with an eye towards future research avenues.

Smart card-based E-payment systems are receiving increasing attention as the number of implementations is witnessed on the rise globally. Understanding of user adoption behavior of E-payment systems that employ smart card technology becomes a research area that is of particular value and interest to both IS researchers and professionals. However, research interest focuses mostly on why a smart card-based E-payment system results in a failure or how the system could have grown into a success. This signals the fact that researchers have not had much opportunity to critically review a smart card-based E-payment system that has gained wide support and overcome the hurdle of critical mass adoption. The Octopus in Hong Kong has provided a rare opportunity for investigating smart card-based E-payment system because of its unprecedented success. This research seeks to thoroughly analyze the Octopus from technology adoption behavior perspectives.

Cultural impacts on adoption behavior are one of the key areas that this research posits to investigate. Since the present research is conducted in Hong Kong where a majority of population is Chinese ethnicity and yet is westernized in a number of aspects, assuming that users in Hong Kong are characterized by eastern or western culture is less useful. Explicit cultural characteristics at individual level are tapped into here instead of applying generalization of cultural beliefs to users to more accurately reflect cultural bias. In this vein, the technology acceptance model (TAM) is adapted, extended, and tested for its applicability cross-culturally in Hong Kong on the Octopus. Four cultural dimensions developed by Hofstede are included in this study, namely uncertainty avoidance, masculinity, individualism, and Confucian Dynamism (long-term orientation), to explore their influence on usage behavior through the mediation of perceived usefulness.

TAM is also integrated with the innovation diffusion theory (IDT) to borrow two constructs in relation to innovative characteristics, namely relative advantage and compatibility, in order to enhance the explanatory power of the proposed research model. Besides, the normative accountability of the research model is strengthened by embracing two social influences, namely subjective norm and image. As the last antecedent to perceived usefulness, prior experience serves to bring in the time variation factor to allow level of prior experience to exert both direct and moderating effects on perceived usefulness.

The resulting research model is analyzed by partial least squares (PLS)-based Structural Equation Modeling (SEM) approach. The research findings reveal that all cultural dimensions demonstrate direct effect on perceived usefulness though the influence of uncertainty avoidance is found marginally significant. Other constructs on innovative characteristics and social influences are validated to be significant as hypothesized. Prior experience does indeed significantly moderate the two influences that perceived usefulness receives from relative advantage and compatibility, respectively. The research model has demonstrated convincing explanatory power and so may be employed for further studies in other contexts. In particular, cultural effects play a key role in contributing to the uniqueness of the model, enabling it to be an effective tool to help critically understand increasingly internationalized IS system development and implementation efforts. This research also suggests several practical implications in view of the findings that could better inform managerial decisions for designing, implementing, or promoting smart card-based E-payment system.

The computing power of the legged robot is not enough to perform high-frequency updates for the full-body model predictive control (MPC) of the robot, which is a common problem encountered in the gait research of the legged robot. The purpose of this paper is to propose a high-frequency MPC control method for the bounding gait of a parallel quadruped robot.

According to the bounding gait characteristics of the robot, the quadruped robot model is simplified to an equivalent plane bipedal model. Under the biped robot model, the forces between the robot’s feet and the ground are calculated by MPC. Then, the authors apply a proportional differential controller to distribute these forces to the four feet of the quadruped robot. The robot video can be seen at www.bilibili.com/video/BV1je4y1S7Rn.

To verify the feasibility of the controller, a prototype was made, and the controller was deployed on the actual prototype and then fully analyzed through experiments. Experiments show that the update frequency of MPC could be stabilized at 500 Hz while the robot was running in the bounding gait stably and efficiently.

This paper proposes a high-frequency MPC controller under the simplified model, which has a higher working efficiency and more stable control performance.

The purpose of this paper is to formulate and test a theoretical model to explain inter-organizational cooperation behaviors among suppliers in automotive new product development (NPD) projects. This study aims to investigate the effects of cost and benefit factors on trust and inter-organizational cooperative behaviors among suppliers in automotive NPD projects from the perspective of social exchange theory (SET).

The structural equation modeling method is applied to test the proposed model, which is based on the analysis of survey data from 272 product managers of automotive part suppliers.

Knowledge sharing and coordination effort influence inter-organizational cooperation indirectly through trust. Specially, trust is negatively influenced by coordination effort but positively affected by knowledge sharing. Requirement uncertainty moderates the relationship between cost–benefit factors and trust differently. Specifically, requirement uncertainty increases the negative influence of coordination effort on trust but also strengthens the positive effect of knowledge sharing on trust.

This study provides a relatively comprehensive cost–benefit framework for further understanding the formation mechanism of inter-organizational cooperation among suppliers. It also contributes to SET by incorporating the contextual factor to explain the moderating effect of requirement uncertainty on the relationships between cost–benefit factors and trust in the context of automotive NPD projects.

This paper aims to study acoustic emission (AE) propagation characteristics by a crack under a moving heat source, which mainly provides theoretical basis and method for the actual crack detection during welding process.

The paper studied the AE characteristics in welding using thermoelastic theory, which investigates the dynamical displacement field caused by a crack and the welding heating effect. In the calculation model, the crack initiation and extension are represented by moment tensor as the AE source, and the welding heat source is the Gauss heat flux distribution. The extended finite element method (XFEM) is implemented to calculate and solve the AE response of a thermoelastic plate with a crack during the welding heating effect. The wavelet transform is applied to the time–frequency analysis of the AE signals.

The paper provides insights about the changing rule of the acoustic radiation patterns influenced by the heating effect of the moving heat source and the AE signal characteristics in thermoelastic plate by different crack lengths and depths. It reveals that the time–frequency characteristics of the AE signals from the simulation are in good agreement with the theoretical ones. The energy ratio of the antisymmetric mode A0 to symmetric mode S0 is a valuable quantitative inductor to estimate the crack depth with a certain regularity.

This paper mainly discusses the application of XFEM to calculate and analyze thermoelastic problems, and has presented few cases based on a specified configuration. Further work will focus on the calculation and analysis under different plate configurations and conditions, which is to obtain more interesting and general conclusions for guiding practice.

The paper is a successful application of XFEM to solve the problem of AE response of a crack in the dynamic welding inhomogeneous heating effect. The paper provides an effective way to obtain the AE signal characteristics in monitoring the welding crack.

The Kirkendall void had been a well-known issue for long-term reliability of semiconductor interconnects; while even the KVs exist at the interfaces of Cu and Sn, it may still be able to pass the condition of unbias long-term reliability testing, especially for 2,000 cycles of temperature cycling test and 2,000 h of high temperature storage. A large number of KVs were observed after 200 cycles of temperature cycling test at the intermetallic Cu₃Sn layer which locate between the intermetallic Cu₆Sn₅ and Cu layers. These kinds of voids will grow proportional with the aging time at the initial stage. This paper aims to compare various IMC thickness as a function of stress test, the Cu₃Sn and Cu₆Sn₅ do affected seriously by heat, but Ni₃Sn₄ is not affected by heat or moisture.

The package is the design in the flip chip-chip scale package with bumping process and assembly. The package was put in reliability stress test that followed AEC-Q100 automotive criteria and recorded the IMC growing morphology.

The Cu₆Sn₅ intermetallic compound is the most sensitive to continuous heat which grows from 3 to 10 µm at high temperature storage 2,000 h testing, and the second is Cu₃Sn IMC. Cu₆Sn₅ IMC will convert to Cu₃Sn IMC at initial stage, and then Kirkendall void will be found at the interface of Cu and Cu₃Sn IMC, which has quality concerning issue if the void’s density grows up. The first phase to form and grow into observable thickness for Ni and lead-free interface is Ni₃Sn₄ IMC, and the thickness has little relationship to the environmental stress, as no IMC thickness variation between TCT, uHAST and HTSL stress test. The more the Sn exists, the thicker Ni₃Sn₄ IMC will be derived from this experimental finding compare the Cu/Ni/SnAg cell and Ni/SnAg cell.

The research found that FCCSP can pass automotive criteria that follow AEC-Q100, which give the confidence for upgrading the package type with higher efficiency and complexities of the pin design.

This result will impact to the future automotive package, how to choose the best package methodology and what is the way to do the package. The authors can understand the tolerance for the kind of flip chip package, and the bump structure is then applied for high-end technology.

The overall three kinds of bump structures, Cu/Ni/SnAg, Cu/SnAg and Ni/SnAg, were taken into consideration, and the IMC growing morphology had been recorded. Also, the IMC had changed during the environmental stress, and KV formation was reserved.

Considering rapid digitalization development, this study examines the impacts of digital technology innovation on social responsibility in platform enterprises.

The study applies the event study method and cross-sectional regression analysis, taking 168 digital technology innovations for social responsibility issued by 88 listed platform enterprises from 2011 to 2022 to study the impact of digital technology innovations for social responsibility announcements of different announcement content and platform attributes on the stock market value of platform enterprises.

The results show that, first, the positive stock market reaction is produced on the same day as the digital technology innovation announcement. Second, the announcement of the platform’s public social responsibility and the announcement of co-innovation and radical innovation bring more positive stock market reactions. In addition, the announcements mentioned above issued by trading platforms bring more positive stock market reactions. Finally, the social responsibility attribution characteristics of the announcement did not have a significant differentiated impact on the stock market reaction.

Most scholars have studied digital technology innovation for social responsibility through modeling rather than second-hand data to empirically examine. This study uses second-hand data with the instrumental stakeholder theory to provide a new research perspective on platform social responsibility. In addition, in order to explore the different impacts of digital technology innovation on social responsibility, this study has classified digital technology innovation for social responsibility according to its social responsibility and digital technology innovation characteristics.